Sizzix Accessory - Die Brush & Foam Pad for Wafer-Thin Dies
- zł44.90
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.
DIMENSIONS MATS: 11,43 x 18,42 cm
PACKAGE: 1 brush + 1 brush mat
REFERENCE: SIZ-660513
EAN: 841182097989
COMPANY: Sizzix
